Morán, Mauricio J. (2019) Fabricación y caracterización estructural de laminas delgadas de Cu-Al-Ni con memoria de forma. / Fabrication and structural characterization of Cu-Al-Ni thin films with shape memory. Tesis Doctoral en Física, Universidad Nacional de Cuyo, Instituto Balseiro.
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Resumen en español
Esta tesis se centra en el estudio de láminas delgadas de aleaciones Cu-Al-Ni con memoria de forma crecidas por pulverización catódica. Éstas poseen potenciales aplicaciones en dispositivos micro electromecánicos. La transformación martensítica del material, que da origen al efecto memoria de forma, es sensible a la microestructura y al espesor de las láminas delgadas. La microestructura, a su vez, depende de las condiciones de fabricación. Con el objetivo de determinar cuáles son las mejores condiciones para obtener láminas delgadas de aleaciones Cu-Al-Ni con efecto memoria de forma, se crecieron láminas a diferentes temperaturas del sustrato (T_S). Esta temperatura, la cual se varió entre temperatura ambiente y 823 K, afecta la microestructura y las características de la transformación martensítica en las láminas. Sobre las láminas que presentaron transformación martensítica, se probaron diferentes métodos para lograr que el material deforme de manera controlada. Estos métodos consistieron en modificar una de las superficies de las láminas, ya sea por litografía con posterior comido iónico o implantación de iones de O o Al. La microestructura de las láminas delgadas fue analizada mediante difracción de rayos X y microscopía electrónica de transmisión. La transformación martensítica fue caracterizada a partir de mediciones de resistencia eléctrica en función de la temperatura. Los resultados muestran que la transformación martensíica es fuertemente afectada por la microestructura, lo cual se evidencia por incrementos en el rango de temperatura de transformación e histéresis mayores respecto a muestras masivas. Se crecieron láminas delgadas de tama~nos de grano comprendidos entre 30 nm y varios micrómetros, las cuales presentan transformación martensítica. Al aumentar el tamaño de grano se encontró que tanto la histéresis como el rango de temperaturas de transformación disminuyen mientras que el salto de resistencia eléctrica aumenta. Esto es producto de la disminución en la densidad de bordes de grano, lo cual disminuye la barrera energética para la transformación martensítica. Analizando láminas delgadas policristalinas de espesores entre 0,10 y 2,25 μm se encontró que al reducir el espesor se estabiliza la fase austenítica, dificultando la transformación martensítica hasta el punto de ser suprimida por completo. El efecto memoria de forma se analizó deformando las láminas a baja temperatura en fase martensítica y observando si se recuperaba la forma al calentar por encima de la temperatura de transformación, en fase austenítica. Este efecto se encontró presente en muestras con tamaños de grano por encima de 100 nm. Se buscó inducir el efecto doble memoria de forma, el cual es la propiedad de los materiales de alternar entre las formas de tanto la fase martensítica como de la fase austenítica. Se halló que la implantación de iones de Al en láminas con tamaño de grano micrométrico dio los mejores resultados.
Resumen en inglés
This thesis focuses on the study of shape memory Cu-Al-Ni thin films based growth by sputtering. These films have potential applications in microelectromechanical systems (MEMS). We found that the martensitic transformation, which originates the shape memory effect, depends on the film thickness and the microstructure. Considering that the microstructure depends on the fabrication conditions and with the objective of determining the optimal growth parameters in Cu-Al-Ni thin films, we modifying the substrate temperature (T_S) between room temperature and 823 K. The changes in the microstructure produced by T_S affect the characteristic features of the martensitic transformation. For the cases where martensitic transformation is observed, we tried to induce controlled shape memory. The methods consisted of supercial modication with geometrical patterns using optical lithography and ion milling, and damage proles using implantation of ions such as O and Al. The microstructure of the thin lms was analyzed by X-ray diffraction and transmission electron microscopy. The martensitic transformation was characterized from resistance versus temperature measurements. The results show that, in comparison with bulk, the changes in the microstructure modify the martensitic transformation temperature, the temperature range of transformation and the hysteresis. We observe martensitic transformation for Cu-Al-Ni thin lms with grain size average between 30 nm and several microns. The increment in the grain size average reduces the temperature range of transformation and the hysteresis, which could be related to the in fluence of the grain boundary density on the energy barriers. The analysis of the martensitic transformation for samples with thicknesses between 0.1 and 2.25 μm shows that the austenitic phase stabilizes as the thickness decreases. The martensitic transformation is completely suppressed for 0.15 μm. We analyze the shape of the memory effect comparing the changes between samples deformed in the martensitic phase (low temperatures) and the austenite phase (room temperature). We found that samples with grain size average above 100 nm recover the original shape. Moreover, we work on producing thin lms that have the two-way memory effect. The best results are obtained for ion implantation with Al.
| Tipo de objeto: | Tesis (Tesis Doctoral en Física) |
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| Palabras Clave: | Thin films; Capas finas; Sputtering; Chisporroteo; [Martensitic transformation; Trasformación martensítica; Shame memory, Memoria de forma] |
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| Materias: | Física |
| Divisiones: | Investigación y aplicaciones no nucleares > Física > Física de metales |
| Código ID: | 799 |
| Depositado Por: | Tamara Cárcamo |
| Depositado En: | 05 Mar 2021 08:30 |
| Última Modificación: | 05 Mar 2021 08:30 |
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